• Wafer annealing furnace
  • Wafer annealing furnace

Wafer annealing furnace

Model : NBD-T1200-250T3

Serial Number

Type

Equipment Technical Specifications

1

Furnace Dimensions

L 1700 × H 1760 × D 850mm

2

Reaction Chamber Dimensions

4-8 inches

3

Main Control Operating Temperature

≤1150℃

4

Main Control Heating Rate

Recommended ≤20°C / min

5

Main Control Heating Element

HRE Ring-shaped High-Temperature Resistance Wire

6

Main Control Furnace Material

Alumina Fiber Insulation Refractory Material

7

Main Control Temperature Zone Length

 259+627+213  Constant Temperature Zone 600mm

8

Temperature Control Range and Accuracy

300~1150℃ ±1℃

9

Heating Rate

Heating Rate ≤15°C / min

Cooling ≤ 5°C / min

10

Sealing method

Stainless steel opening flange

11

Flange structure

Quick-opening type

12

Temperature measuring element

K-type thermocouple

13

Radial temperature field distribution millivolt value

As detailed in the introduction

14

Flowmeter type

3-way float flowmeter

customer-defined flow specifications

◎ CE certified.

◎ Brand: NOBODY

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