Wafer annealing furnace

Item-Name:

Wafer annealing furnace

Specification:
  1. Furnace size: 1700*1760*850 (length*height*depth) (mm)

 

  1. Reaction chamber size: 4-8 inches

 

  1. Main control operating temperature ≤1150

 

  1. Main control heating rate: recommended ≤20/min

 

  1. Main control heating element: ring HRE high temperature resistance wire

 

  1. Main control furnace material: alumina fiber insulation refractory material

 

  1. Main temperature control zone length: 259+627+213 constant temperature zone 600mm

 

  1. Temperature control range and accuracy: 300~1150℃±1

 

  1. Heating and cooling rate: heating ≤ 15/min cooling ≤ 5/min

 

10.Sealing method: stainless steel opening flange

 

11.Flange structure: quick opening

 

  1. Temperature measuring element: K-type thermocouple

 

  1. Radial temperature field distribution millivolt value: as detailed introduction

 

  1. Flowmeter type: 3-way float flowmeter (customer-defined flow specifications)

 

 

Passed CE certification

 

◎Brand: NOBODY